Panasonic SMT Chip Mounter NPM-D3

Panasonic SMT Chip Mounter NPM-D3

Panasonic NPM-D3A Modular Pick And Place Machine

Adoption of the light-weight 16-nozzle head V3
Improving Placement tact time by simultaneously driving X-/Y-axes and selecting optimal pathways during component recognition operation.

Advancement of head drive unit motion control
Improving placement tact time by further advancing motion control and thereby reducing X-/Z-axis travel time.

Use of new pickup operation algorithm
Improving effective productivity by enhancing pickup algorithm for microchips.

Keywords:

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Specification

Model ID	NPM-D3
Rear head Front head	Lightweight 16-nozzle head	12-nozzle head	8-nozzle head	2-nozzle head	Dispensing head	No head
Lightweight 16-nozzle head	NM-EJM6D				NM-EJM6D-MD	NM-EJM6D
12-nozzle head
8-nozzle head
2-nozzle head
Dispensing head	NM-EJM6D-MD					NM-EJM6D-D
Inspection head	NM-EJM6D-MA					NM-EJM6D-A
No head	NM-EJM6D				NM-EJM6D-D

PCB dimensions*1 (mm)	Dual-lane mode	L 50 x W 50 ~ L 510 x W 300
	Single-lane mode	L 50 x W 50 ~ L 510 x W 590
PCB exchange time	Dual-lane mode	0 s* *No 0s when cycle time is 3.6 s or less
	Single-lane mode	3.6 s* *When selecting short conveyors
Electric source		3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA
Pneumatic source *2		0.5 MPa, 100 L /min (A.N.R.)
Dimensions *2 (mm)		W 832 x D 2 652 3 x H 1 444 4
Mass		1 680 kg (Only for main body:This differs depending on the option configuration.)

Placement head		Lightweight 16-nozzle head (Per head)		12-nozzle head (Per head)	8-nozzle head (Per head)	2-nozzle head (Per head)
		High production mode [ON]	High production mode [OFF]
Max. speed		42 000 cph (0.086 s/ chip)	38 000 cph (0.095 s/ chip)	34 500 cph (0.104 s/ chip)	21 500 cph (0.167 s/ chip)	5 500 cph (0.655 s/ chip) 4 250 cph (0.847 s/ QFP)
Placement accuracy (Cpk□1)		± 40 µm/chip	±30 μm / chip (±25 μm / chip*5)	±30 μm / chip	± 30 µm/chip ± 30 µm/QFP □ 12mm to □ 32mm ± 50 □ 12mm Underµm/QFP	± 30 µm/QFP
Component dimensions (mm)		0402 chip*6 to L 6 x W 6 x T 3	0301567/0402 chip*6 to L 6 x W 6 x T 3	0402 chip*6 to L 12 x W 12 x T 6.5	0402 chip*6 to L 32 x W 32 x T 12	0603 chip to L 100 x W 90 x T 28
Component supply	Taping	Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm
	Taping	Max. 68 (4, 8 mm tape, Small reel)
	Stick				Max.16 (Single stick feeder)
	Tray				Max.20 (per tray feeder)

Dispensing head	Dot dispensing	Draw dispensing
Dispensing speed	0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation)	4.25 s/component (Condition: 30 mm x 30 mm corner dispensing)*8
Adhesive position accuracy (Cpk□1)	± 75 μ m /dot	± 100 μ m /component
Applicable components	1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP	SOP,PLCC,QFP, Connector, BGA, CSP

Inspection head		2D inspection head (A)	2D inspection head (B)
Resolution		18 µm	9 µm
View size (mm)		44.4 x 37.2	21.1 x 17.6
Inspectionb processing time	Solder Inspection*9	0.35s/ View size
	Component Inspection*9	0.5s/ View size
Inspection object	Solder Inspection *9	Chip component : 100 μm x 150 μm or more (0603 mm or more) Package component : φ150 μm or more	Chip component : 80 μm x 120 μm or more (0402 mm or more) Package component : φ120 μm or more
	Component Inspection *9	Square chip (0603 mm or more), SOP, QFP (a pitch of 0.4 mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10	Square chip (0402 mm or more), SOP, QFP (a pitch of 0.3 mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10
Inspection items	Solder Inspection *9	Oozing, blur, misalignment, abnormal shape, bridging
	Component Inspection *9	Missing, shift, flipping, polarity, foreign object inspection *11
Inspection position accuracy *12 ( Cpk□1)		± 20 μm	± 10 μm
No. of inspection	Solder Inspection *9
	Component Inspection *9

*1 :	Due to a difference in PCB transfer reference, a direct connection with NPM (NM-EJM9B) / NPM-W (NM-EJM2D) /NPM-W2 (NM-EJM7D) dual lane specs cannot be established.
*2 :	Only for main body
*3 :	Dimension D including tray feeder : 2 683 mm Dimension D including feeder cart : 2 728 mm
*4 :	Excluding the monitor, signal tower and ceiling fan cover.
*5 :	±25 μm placement support option.(Under conditions specified by Panasonic)
*6 :	The 03015/0402 mm chip requires a specific nozzle/feeder.
*7 :	Support for 03015 mm chip placement is optional.(Under conditions specified by Panasonic:Placement accuracy ±30 μm / chip )
*8 :	A PCB height measurement time of 0.5s is included.
*9 :	One head cannot handle solder inspection and component inspection at the same time.
*10 :	Please refer to the specification booklet for details.
*11 :	Foreign object is available to chip components. (Excluding 03015 mm chip)
*12 :	This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.